Open Access Open Access  Restricted Access Subscription or Fee Access

Fin-Set Materials Analysis for Heat Removal Utilizing ANSYS

Yogendra Singh Tomar, C.S. Kohli

Abstract


Present paper deals with the effect of fin material on heat transfer from fin for electronics device cooling. Electronic tools discharge heat in the course of the work; that discharged heat should be removed either by passive or active ways. Current work stresses on passive (natural) way of cooling. Natural cooling can be done either by free air or fin. Different types of fin materials have been studied in the present work to observe their effect on heat transfer. Electronic device which generated heat at a rate of 1.5 W was made of copper and container which enclosed the electronic device was considered to be made up of steel. Convective boundary conditions which represent the actual physical scenario have been considered at the outer walls. Heat transfer coefficient of convection in the atmosphere has been considered around h=40 W/m2 ºK and the ambient temperature was 27 ºC.

Keywords: Fin material, micro heat exchanger (MHE), heat transfer, finite element analysis (FEA), electronic device

 

Cite this Article
Tomar YS, Kohli CS. Fin-Set Materials Analysis for Heat Removal Utilizing ANSYS. Journal of Advancements in Robotics. 2016; 3(1): 24–30p.


Full Text:

PDF

References


Cheng HH, Huang DS, Lin MT. Heat dissipation design and analysis of high power LED array using the finite element method. Microelectron Reliab. 2012; 52: 905–11p.

Bahadur R, Cohen AB. Orthotropic thermal conductivity effect on cylindrical pin fin heat transfer. Int J Heat Mass Transf. 2007; 50: 1155–62p.

Bricault P, Dombsky M, Dowling A, et al. High power target developments at ISAC. Nuclear Instruments and Methods in Physics Research B. 2003; 204: 319–24p.

Elnggar MHA, Abdullah MZ, Mujeebu MA. Experimental Analysis and FEM Simulation for Desktop PC Cooling using Finned U-Shape Multi Heat Pipe. Energ Convers Manage. 2011; 52: 2937–44p.

Galvis E, Jubran BA, Behdinan FK, et al. Numerical Modelling of Pin–Fin Micro Heat Exchanger. Heat Mass Transfer. 2008; 44: 659–66p.

Husain A, Kim KY. Optimization of a Micro-Channel Heat Sink with Temperature Dependent Fluid Properties. Appl Therm Eng. 2008; 28: 1101–7p.

Islamoglu Y. Numerical Analysis of the Influence of a Circular Fin with Different Profiles on the Thermal Characteristics in a Ceramic Tube of Heat Transfer Equipment. Int J Pres Ves Pip. 2004; 81: 583–7p.

Kolluri S, Endo K, Suzuki E, et al. Modelling and Analysis of Self-Heating in Fin-FET Devices for Improved Circuit and EOS/ESD Performance. Proceedings of the IEEE Electron Devices Meeting; 2007 Dec 10–12; Washington, DC. 177–80p.

Zhang Q, Wang W, Zhang H, et al. Temperature Analysis of Continuous-Flow Micro-PCR based on FEA. Sensor Actuat B. 2002; 82: 75–81p.

Li Y, Xu Q. Designed and Analysis of a Totally Decoupled Flexure-Based XY Parallel Micromanipulator. IEEE T Robotic. 2009; 25(3): 645–57p.


Refbacks

  • There are currently no refbacks.


This site has been shifted to https://stmcomputers.stmjournals.com/