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Fin-Set Materials Analysis for Heat Removal Utilizing ANSYS

Yogendra Singh Tomar, C.S. Kohli


Present paper deals with the effect of fin material on heat transfer from fin for electronics device cooling. Electronic tools discharge heat in the course of the work; that discharged heat should be removed either by passive or active ways. Current work stresses on passive (natural) way of cooling. Natural cooling can be done either by free air or fin. Different types of fin materials have been studied in the present work to observe their effect on heat transfer. Electronic device which generated heat at a rate of 1.5 W was made of copper and container which enclosed the electronic device was considered to be made up of steel. Convective boundary conditions which represent the actual physical scenario have been considered at the outer walls. Heat transfer coefficient of convection in the atmosphere has been considered around h=40 W/m2 ºK and the ambient temperature was 27 ºC.

Keywords: Fin material, micro heat exchanger (MHE), heat transfer, finite element analysis (FEA), electronic device


Cite this Article
Tomar YS, Kohli CS. Fin-Set Materials Analysis for Heat Removal Utilizing ANSYS. Journal of Advancements in Robotics. 2016; 3(1): 24–30p.

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